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Automatic BGA Rework Station with CCD Optical Alignment and 1℃ Temp Control for Mobile Phone PCB Repair

Automatic BGA Rework Station with CCD Optical Alignment and 1℃ Temp Control for Mobile Phone PCB Repair

Merknaam: HSTECH
Modelnummer: HS-700
Moq: 1 st
Prijs: Negotation
Betalingsvoorwaarden: T/T
Toeleveringsvermogen: 1 Instellen
Gedetailleerde informatie
Plaats van herkomst:
China
Certificering:
CE,ISO
PCB-formaatbereik:
Maximaal 140 mm × 160 mm / minimaal 5 mm × 5 mm
Totaal vermogen:
2600w
Plaatsbepalingssysteem:
V-vormige PCB-ondersteuning + universele armatuur + lasercentrering
Verwarming vermogen:
Bovenverwarming 1200W(Max), onderverwarming 1200W(Max)
Voeding:
Wisselstroom 100V / 220V±10% 50/60Hz
Temperatuurregeling:
Hoge precisie K-sensor + gesloten lusregeling ±1℃
Verpakking Details:
Houten
Levering vermogen:
1 Instellen
Productbeschrijving

Automatic BGA Rework Station CCD Color Optical Alignment System 0.01mm Mounting Accuracy 1℃ Temp Control Mobile Phone PCB Repair

Product Introduction

Welcome to our premium Automatic BGA Rework Station, a high-performance solution designed for professional mobile phone PCB repair and complex motherboard maintenance. Engineered for modern electronics manufacturing and repair centers, this BGA rework machine integrates an advanced CCD color optical alignment system with intelligent temperature control. Whether you are dealing with fine-pitch BGA, QFN, or CSP components, this precision BGA rework system guarantees flawless mounting and reliable soldering results, making it an essential BGA soldering station for demanding repair tasks.

Key Features
  • 5 work modes: Semi-auto/Manual/Remove/Mount/Weld
  • 15" HD LCD monitor with 7" color touch screen interface
  • Stepping motor with CCD color optical alignment system
  • Temperature accuracy within ±1℃
  • Mounting precision within ±0.01mm
  • Repair success rate: 99%+
  • Independent research and development of single-chip control
Technical Specifications
Model HS-700
Power Supply AC 100V / 220V±10% 50/60Hz
Total Power 2600W
Heater Power Top heater 1200W(Max), bottom heater 1200W(Max)
Temperature Control High precision K-sensor + closed loop control ±1℃
Locating System V shape PCB support + universal fixture + laser centering
PCB Size Range Max 140mm×160mm / Min 5mm×5mm
BGA Size Range Max 50mm×50mm / Min 1mm×1mm
Mounting Accuracy ±0.01mm
Machine Weight 30KG
Wide Application Scenarios

This precision BGA Rework Station covers almost all high-precision electronic rework and maintenance fields, with strong versatility and high practicability, fully adapting to commercial and industrial use scenarios:

  • Mobile Phone & Digital Device Repair: Professional for motherboard chip rework, CPU, flash memory, baseband chip desoldering and soldering of smartphones, tablets and wearable devices, solving various motherboard failure problems.
  • SMT Factory Production Rework: Used for defect repair of BGA and SMD components in SMT patch production line, rework of unqualified circuit boards, improving product qualification rate.
  • Precision Electronic Maintenance: Suitable for chip repair of communication equipment, automotive electronics, industrial control boards, medical electronic equipment and other high-precision products.
  • Laboratory & Teaching Research: Applied in electronic engineering teaching, chip welding research and development, prototype test and small-batch sample production.
  • Professional Maintenance Workshop: The preferred equipment for electronic maintenance studios and after-sales maintenance teams, supporting long-term high-intensity daily rework operations.
Why Choose Our BGA Rework Station

In the competitive precision electronic rework equipment market, our Automatic BGA Rework Station has always won high recognition from global customers with reliable quality, superior performance and cost-effective advantages:

  • Industry-leading Precision Configuration: Adopts industrial-grade CCD color optical system and 1℃ high-precision temperature control module, with 0.01mm ultra-high positioning accuracy. The core configuration is comparable to high-end industrial equipment, ensuring zero error precision rework of tiny chips.
  • Strict Quality & Process Standards: All machines are manufactured in strict accordance with international lead-free soldering standards and industrial production specifications. Each equipment undergoes strict aging test and precision calibration before delivery, with stable performance and low failure rate.
  • High Cost Performance: Compared with similar imported equipment, our BGA rework machine has higher configuration and more complete functions, with more competitive price. It reduces equipment investment cost for users while ensuring professional rework quality.
  • User-oriented Operation Experience: Simplified intelligent operation system, no complicated professional operation required. The visual alignment operation is intuitive and clear, which can quickly improve the working efficiency of maintenance technicians and shorten the learning cycle.
  • Global After-sales Support: We provide standardized operation manuals, video tutorials and professional remote technical guidance. With complete accessory support and reliable after-sales service, users can use the equipment without worries.
  • Durable Industrial Grade Performance: The whole machine is made of high-quality materials, with anti-high temperature, anti-deformation and anti-interference capabilities. It can adapt to long-term continuous work in various working environments and has a long service life.
Get Started Today

Upgrade your repair capabilities with our top-tier Automatic BGA Rework Station. Don't let faulty motherboards slow down your production. Contact us now to request a quote, get a detailed product video, or consult with our technical experts about the best BGA rework machine for your specific needs. Let us help you achieve flawless mobile phone PCB repair results every time!

Automatic BGA Rework Station with CCD Optical Alignment and 1℃ Temp Control for Mobile Phone PCB Repair 0

Automatic BGA Rework Station with CCD Optical Alignment and 1℃ Temp Control for Mobile Phone PCB Repair 1

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